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News Summary
19 May 2003

2003 IEEE MTT-S, International Microwave Exhibition,
Pennsylvania Convention Center, Philadelphia, 10-12 June 2003
7 layers on booth 2619

Make your research and development test procedures more efficient with InterLab® from 7 layers

Hardware, RF and software components testing
InterLab® supports your test and documentation procedures for hardware components like RF parts, baseband parts and circuits. It is ideal for further HW components like evaluation boards, reference designs, application boards etc. and for SW parts such as protocols, application software, baseband software etc.

Integration and implementation testing
Finding out how hardware and software components function together is a complex task that becomes easier and more efficient to handle with InterLab®.

Product evaluation testing
Test procedures necessary to cover your company’s risk policy can be set up, run and documented easily with InterLab®. You can either integrate your own tests into the InterLab® system or use new test cases developed by 7 layers to suit your purposes.

Click here to go to the website of IEEE International Microwave Symposium

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last update: 2004-01-19
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